http://community.edc.intel.com/ Embedded Community Sun, 29 Nov 2009 12:36:00 GMT Community 2009-11-29T12:36:00Z http://community.edc.intel.com/t5/Applications-Other-Blog/Intel-Strengthens-Commitment-to-Embedded/ba-p/1684 Building on our successful 30-year history, Intel continues to deliver products and technologies that propel the embedded industry. However, we don't do it alone. Our ecosystem plays an important role, and it is their Intel® architecture-based products that power some of today's most exciting smart devices. As the proliferation of intelligent, connected products continues, Intel is uniquely positioned to lead the evolution with help from our partners. To that end, Intel recently announced two significant changes. Both will have a positive impact on our globally recognized ecosystem and you, our customers. Wed, 25 Nov 2009 20:01:20 GMT http://community.edc.intel.com/t5/Applications-Other-Blog/Intel-Strengthens-Commitment-to-Embedded/ba-p/1684 Tsmith_intel 2009-11-25T20:01:20Z http://community.edc.intel.com/t5/Applications-Other-Blog/Engaging-distant-friends-in-your-shopping-decisions/ba-p/1673 Roving Reporter: Engaging distant friends in your shopping decisions Tue, 24 Nov 2009 17:05:27 GMT http://community.edc.intel.com/t5/Applications-Other-Blog/Engaging-distant-friends-in-your-shopping-decisions/ba-p/1673 MarkScantlebury 2009-11-24T17:05:27Z http://community.edc.intel.com/t5/Applications-Other-Blog/Opening-Military-Aerospace-and-Government-Apps-MAG-Panel-E-cast/ba-p/1648 MAG is shorthand for Intel and the Intel® Embedded Alliance partners renewed focus on military, aerospace, and government applications. In this exclusive online event, a panel from Intel, Emerson, and RadiSys discussed the uses of and trends surrounding open standard computing platforms running on Intel Architecture processors. Mon, 16 Nov 2009 22:57:14 GMT http://community.edc.intel.com/t5/Applications-Other-Blog/Opening-Military-Aerospace-and-Government-Apps-MAG-Panel-E-cast/ba-p/1648 DonD-OSM 2009-11-16T22:57:14Z http://community.edc.intel.com/t5/Hardware-Blog/COM-Express-Ruggedized-And-Ready-For-The-Field/ba-p/1643 Whether it's an emergency responder robot, a remote sensor on a traffic light, or a telecommunications tower, embedded technology is finding its way into products that need to operate flawlessly at extreme temperatures and hold up in some of the most rugged environments on earth–and off of it. Although a growing range of applications often need durable embedded solutions, military and government projects require technology that can withstand especially harsh environments and temperatures while performing critical functions. Fri, 13 Nov 2009 23:57:30 GMT http://community.edc.intel.com/t5/Hardware-Blog/COM-Express-Ruggedized-And-Ready-For-The-Field/ba-p/1643 lorcino_radisys 2009-11-13T23:57:30Z http://community.edc.intel.com/t5/New-to-Intel-Architecture-Blog/Green-Hills-Probe-adds-JTAG-debug-support-for-Intel-Architecture/ba-p/1615 For over a decade, developers adopting embedded Intel® Architecture processors had been limited to a single choice of JTAG debugger. But just within the last few weeks, three new options were introduced. Read about how these latest available tools benefit the IA developer. Tue, 10 Nov 2009 03:57:06 GMT http://community.edc.intel.com/t5/New-to-Intel-Architecture-Blog/Green-Hills-Probe-adds-JTAG-debug-support-for-Intel-Architecture/ba-p/1615 Felix_M 2009-11-10T03:57:06Z http://community.edc.intel.com/t5/Hardware-Blog/Seeing-Is-Believing/ba-p/1614 Best Practices for Routing VGA Signals in Multi-Core COM Express Solutions Tue, 10 Nov 2009 00:56:52 GMT http://community.edc.intel.com/t5/Hardware-Blog/Seeing-Is-Believing/ba-p/1614 kontron_cvdg 2009-11-10T00:56:52Z http://community.edc.intel.com/t5/Hardware-Blog/Roving-Reporter-COM-Express-Product-Roundup/ba-p/1612 Many space-limited embedded applications require significant processing performance and substantial I/O capabilities in a compact form factor. Enter COM Express. COM Express modules can serve as standalone boards by themselves or can be used as a processor mezzanine card. The COM Express board design allows you to swap one COM Express module for another whenever your design needs a performance upgrade. Mon, 09 Nov 2009 15:30:25 GMT http://community.edc.intel.com/t5/Hardware-Blog/Roving-Reporter-COM-Express-Product-Roundup/ba-p/1612 sleibson 2009-11-09T15:30:25Z http://community.edc.intel.com/t5/Applications-Other-Blog/Roving-Reporter-IVI-Part-4-Innovative-technologies-geek-out/ba-p/1607 Software providers, board manufacturers, and complementary silicon vendors are advancing automotive electronics innovation using Intel architecture as the base technology. Thu, 05 Nov 2009 18:30:10 GMT http://community.edc.intel.com/t5/Applications-Other-Blog/Roving-Reporter-IVI-Part-4-Innovative-technologies-geek-out/ba-p/1607 JenniferH-OSM 2009-11-05T18:30:10Z http://community.edc.intel.com/t5/Applications-Other-Blog/Roving-Reporter-Digital-Signage-Comes-Alive-Part-1/ba-p/1610 Digital signage is a fast growing area using embedded computing to attract, engage, and inform consumers. In this series, we're looking at what goes into a digital signage system. This first installment has an overview of what makes up a system, and what leading companies from the Intel® Embedded Alliance see as make-or-break points to consider. Thu, 05 Nov 2009 03:32:52 GMT http://community.edc.intel.com/t5/Applications-Other-Blog/Roving-Reporter-Digital-Signage-Comes-Alive-Part-1/ba-p/1610 DonD-OSM 2009-11-05T03:32:52Z http://community.edc.intel.com/t5/Software-Tools-Blog/Roving-Reporter-Simplify-software-development-for-embedded/ba-p/1606 Simplified software development, more robust systems, expanded programmer base, easier to modify software, reduced debug time, easier to demonstrate correct operation under all conditions, and protection from errant software. These are all benefits that developers can gain today by employing Intel® Virtualization Technology(VT) in new embedded developments. Tue, 03 Nov 2009 04:03:04 GMT http://community.edc.intel.com/t5/Software-Tools-Blog/Roving-Reporter-Simplify-software-development-for-embedded/ba-p/1606 Henry-Davis 2009-11-03T04:03:04Z http://community.edc.intel.com/t5/Software-Tools-Blog/Roving-Reporter-Improving-system-availability-Using/ba-p/1601 Imagine you’re talking with friends on the phone when the phone goes dead. The reason it went dead? Failure of the central office control system. OK, so this situation isn’t usually critical. But think of system availability problems in other embedded systems: military flight controls and munitions, medical, and telecom to name a few. Someone could literally die. Tue, 03 Nov 2009 03:51:55 GMT http://community.edc.intel.com/t5/Software-Tools-Blog/Roving-Reporter-Improving-system-availability-Using/ba-p/1601 Henry-Davis 2009-11-03T03:51:55Z http://community.edc.intel.com/t5/New-to-Intel-Architecture-Blog/Roving-Reporter-QPI-Delivers-NUMA-and-Maximizes-Memory-I-O-and/ba-p/1605 The new microarchitecture codenamed Nehalem introduced a new system architecture called Intel® QuickPath Technology. The centerpiece of the new platform is the Intel® QuickPath Interconnect (QPI) that will provide point-to-point links for I/O and interprocessor communications, and enable a dedicated memory controller. The scalable QPI architecture can deliver 6.4 Gigatransfers/second maximizing performance in multiprocessor designs. Mon, 02 Nov 2009 23:55:08 GMT http://community.edc.intel.com/t5/New-to-Intel-Architecture-Blog/Roving-Reporter-QPI-Delivers-NUMA-and-Maximizes-Memory-I-O-and/ba-p/1605 Maury_Wright 2009-11-02T23:55:08Z http://community.edc.intel.com/t5/New-to-Intel-Architecture-Blog/Roving-Reporter-ACPI-and-Intel-Atom-C6-State-Deliver-Performance/ba-p/1599 The Advanced Configuration & Power Interface (ACPI) industry standard formalizes an operating-system-controlled power-management scheme to slash power at the system, processor, and device levels. And processors such as the Intel® Atom™ Z Series include a revolutionary new C6 sleep state that reduces idle power to the 80mW range. Thu, 29 Oct 2009 22:42:06 GMT http://community.edc.intel.com/t5/New-to-Intel-Architecture-Blog/Roving-Reporter-ACPI-and-Intel-Atom-C6-State-Deliver-Performance/ba-p/1599 Maury_Wright 2009-10-29T22:42:06Z http://community.edc.intel.com/t5/Applications-Other-Blog/Roving-Reporter-Development-shortcuts-on-the-infotainment/ba-p/1591 Development shortcuts on the infotainment superhighway from a Roving Reporter. Wed, 28 Oct 2009 16:29:25 GMT http://community.edc.intel.com/t5/Applications-Other-Blog/Roving-Reporter-Development-shortcuts-on-the-infotainment/ba-p/1591 MarkScantlebury 2009-10-28T16:29:25Z http://community.edc.intel.com/t5/Applications-Other-Blog/Roving-Reporter-IVI-Part-3-Reference-design-outlines-roadmap-for/ba-p/1583 An IVI system needs a reliable hardware platform to speed development and ensure interoperability. Tue, 27 Oct 2009 22:14:34 GMT http://community.edc.intel.com/t5/Applications-Other-Blog/Roving-Reporter-IVI-Part-3-Reference-design-outlines-roadmap-for/ba-p/1583 JenniferH-OSM 2009-10-27T22:14:34Z http://community.edc.intel.com/t5/Applications-Other-Blog/BLACK-SAND/ba-p/1584 Black Sand is an initiative within the Embedded Group to enable an ecosystem of developers, scholars, students, hackers and hobbyists adding hardware and software support for a related series of low cost Embedded Atom Boards. Tue, 27 Oct 2009 00:11:41 GMT http://community.edc.intel.com/t5/Applications-Other-Blog/BLACK-SAND/ba-p/1584 rethinker 2009-10-27T00:11:41Z http://community.edc.intel.com/t5/New-to-Intel-Architecture-Blog/Roving-Reporter-Processor-Thermal-Protection-Ensures-Reliable/ba-p/1581 Many embedded applications require the maximum performance that today’s processors have to offer, and must reliably operate around the clock. Intel® Architecture (IA) processors offer embedded teams a leg up in reliable system design. That advantage is precise temperature sensors on chip, and automatic thermal protection capabilities integrated into the processor. Mon, 26 Oct 2009 23:38:23 GMT http://community.edc.intel.com/t5/New-to-Intel-Architecture-Blog/Roving-Reporter-Processor-Thermal-Protection-Ensures-Reliable/ba-p/1581 Maury_Wright 2009-10-26T23:38:23Z http://community.edc.intel.com/t5/Software-Tools-Blog/Roving-Reporter-Mixing-Hard-Realtime-and-General-Purpose-O-S/ba-p/1579 For more than 30 years Virtual Machine (VM) technology was exclusively the domain of multi-million dollar mainframes. While the VM approach was originally aimed at running multiple instances of the same Operating System (OS), this began to change with the introduction of high end servers. IT professionals wanted to simplify their infrastructure by hosting multiple OSes on a single server. Sun, 25 Oct 2009 21:47:27 GMT http://community.edc.intel.com/t5/Software-Tools-Blog/Roving-Reporter-Mixing-Hard-Realtime-and-General-Purpose-O-S/ba-p/1579 Henry-Davis 2009-10-25T21:47:27Z http://community.edc.intel.com/t5/Hardware-Blog/Roving-Reporter-Cooling-the-Atom/ba-p/1574 Cooling rugged, high-performance embedded systems has always been a tough assignment. The Intel® Atom™ microprocessors with their incredibly low TDP (thermal design power) ease the task of cooling a system, but the conventional approach of relying on convection cooling with an appropriate heat sink bonded to the processor simply won’t work in extreme military and aerospace environments. Makers of single-board computers destined to be used in rugged environments have addressed this problem for years and their heat-extracting solutions are very instructive. Fri, 23 Oct 2009 02:59:38 GMT http://community.edc.intel.com/t5/Hardware-Blog/Roving-Reporter-Cooling-the-Atom/ba-p/1574 sleibson 2009-10-23T02:59:38Z http://community.edc.intel.com/t5/Applications-Other-Blog/Roving-Reporter-Untangling-the-wires-in-patient-monitoring/ba-p/1542 Untangling the wires in patient monitoring Thu, 15 Oct 2009 16:44:36 GMT http://community.edc.intel.com/t5/Applications-Other-Blog/Roving-Reporter-Untangling-the-wires-in-patient-monitoring/ba-p/1542 MarkScantlebury 2009-10-15T16:44:36Z